The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Mar. 18, 2013
Applicant:

Wako Pure Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Osamu Matsuda, Saitama, JP;

Nobuyuki Kikuchi, Saitama, JP;

Ichiro Hayashida, Tokyo, JP;

Satoshi Shirahata, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/3213 (2006.01); C23F 1/38 (2006.01); H01L 21/306 (2006.01); C23F 1/44 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01L 21/32134 (2013.01); C23F 1/38 (2013.01); C23F 1/44 (2013.01);
Abstract

An etching agent for a semiconductor substrate, which is capable of etching a titanium (Ti)-based metal film on a semiconductor substrate and an etching method using the etching agent, and relates to a liquid for preparing the etching agent for a semiconductor substrate composed of a solution comprising (A) hydrogen peroxide, (B) a phosphonic acid chelating agent having a hydroxyl group, (C) a basic compound, and (D-1) a copper anticorrosive. An etching method for etching a titanium (Ti)-based metal film on a semiconductor substrate using the etching agent. A solution comprising (B) a phosphonic acid chelating agent having a hydroxyl group, (C) a basic compound, and (D-1) a copper anticorrosive.


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