The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Feb. 29, 2008
Catherine M. Shapiro, Omaha, NE (US);
Corey L. Berends, Omaha, NE (US);
Brian M. Degner, Omaha, NE (US);
Jess C. Sweley, Omaha, NE (US);
Stephanie L. Bills, Halifax, PA (US);
Christopher M. Branda, Lewisburg, PA (US);
Kim M. Folta, Omaha, NE (US);
Robert Kim, Naperville, IL (US);
Sue Lai, Chicago, IL (US);
Pamela A. Poulis, Lewisburg, PA (US);
Jesse Jay Spungin, Chicago, IL (US);
Katie M. Bartholomew, Wheaton, IL (US);
Lynda A. Deakin, Oakland, CA (US);
Todd T. S. Holscher, Elmhurst, IL (US);
Grace J. Hwang, Menlo Park, CA (US);
Mark M. Kavanagh, Omaha, NE (US);
Michelle S. K. Lee, San Francisco, CA (US);
Adam M. Mack, Menlo Park, CA (US);
Eleanor D. Morgan, San Francisco, CA (US);
John W. Smith, San Francisco, CA (US);
David C. Thomsen, San Mateo, CA (US);
Gabriel M. Trionfi, San Carlos, CA (US);
Ana T. Yuan Chang, Cupertino, CA (US);
Catherine M. Shapiro, Omaha, NE (US);
Corey L. Berends, Omaha, NE (US);
Brian M. Degner, Omaha, NE (US);
Jess C. Sweley, Omaha, NE (US);
Stephanie L. Bills, Halifax, PA (US);
Christopher M. Branda, Lewisburg, PA (US);
Kim M. Folta, Omaha, NE (US);
Robert Kim, Naperville, IL (US);
Sue Lai, Chicago, IL (US);
Pamela A. Poulis, Lewisburg, PA (US);
Jesse Jay Spungin, Chicago, IL (US);
Katie M. Bartholomew, Wheaton, IL (US);
Lynda A. Deakin, Oakland, CA (US);
Todd T. S. Holscher, Elmhurst, IL (US);
Grace J. Hwang, Menlo Park, CA (US);
Mark M. Kavanagh, Omaha, NE (US);
Michelle S. K. Lee, San Francisco, CA (US);
Adam M. Mack, Menlo Park, CA (US);
Eleanor D. Morgan, San Francisco, CA (US);
John W. Smith, San Francisco, CA (US);
David C. Thomsen, San Mateo, CA (US);
Gabriel M. Trionfi, San Carlos, CA (US);
Ana T. Yuan Chang, Cupertino, CA (US);
ConAgra Foods RDM, Inc., Omaha, NE (US);
Abstract
A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures.