The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Dec. 07, 2012
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kenta Furusawa, Yokohama, JP;

Keiji Matsumoto, Yokohama, JP;

Keisuke Kishimoto, Yokohama, JP;

Kazuhiro Asai, Kawasaki, JP;

Shuji Koyama, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 15/00 (2006.01); B41J 2/16 (2006.01); B44C 1/22 (2006.01);
U.S. Cl.
CPC ...
B44C 1/227 (2013.01); B41J 2/1629 (2013.01); B41J 2/1634 (2013.01); B41J 2/1639 (2013.01); B41J 2/1603 (2013.01); B41J 2/1643 (2013.01);
Abstract

Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate.


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