The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Feb. 09, 2010
Glenn L. Cellier, Hopewell Junction, NY (US);
Laertis Economikos, Wappingers Falls, NY (US);
Timothy M. Mccormack, Pleasant Valley, NY (US);
Rajasekhar Venigalla, Hopewell Junction, NY (US);
Glenn L. Cellier, Hopewell Junction, NY (US);
Laertis Economikos, Wappingers Falls, NY (US);
Timothy M. McCormack, Pleasant Valley, NY (US);
Rajasekhar Venigalla, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.