The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Oct. 04, 2013
Applicant:

Sumco Techxiv Corporation, Omura, JP;

Inventors:

Yasuhito Narushima, Omura, JP;

Fukuo Ogawa, Omura, JP;

Shinichi Kawazoe, Omura, JP;

Toshimichi Kubota, Omura, JP;

Assignee:

Sumco Techxiv Corporation, Omura-shi, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 11/00 (2006.01); C30B 15/00 (2006.01); C30B 21/06 (2006.01); C30B 27/02 (2006.01); C30B 28/10 (2006.01); C30B 30/04 (2006.01); C30B 9/00 (2006.01); C30B 17/00 (2006.01); C30B 21/02 (2006.01); C30B 28/06 (2006.01); C30B 15/20 (2006.01); C30B 15/04 (2006.01); C30B 29/06 (2006.01);
U.S. Cl.
CPC ...
C30B 15/20 (2013.01); C30B 15/04 (2013.01); C30B 29/06 (2013.01);
Abstract

In consideration of influence of segregation, an evaporation area of a volatile dopant and influence of pulling-up speed at the time of manufacturing a monocrystal using a monocrystal pulling-up device, an evaporation speed formula for calculating evaporation speed of the dopant is derived. At predetermined timing during pulling-up, gas flow volume and inner pressure in a chamber are controlled such that a cumulative evaporation amount of the dopant, calculated based on the evaporation speed formula, becomes a predetermined amount. A difference between a resistivity profile of the monocrystal predicted based on the evaporation speed formula and an actual resistivity profile is made small. Since no volatile dopant is subsequently added, increase in workload on an operator, increase of manufacturing time, an increase in amorphous adhering to the inside of the chamber, and an increase in workload at the time of cleaning the inside of the chamber can be prevented.


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