The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Mar. 15, 2013
Applicant:

Tokyo Electron Limited, Minato-ku, JP;

Inventors:

Kousuke Yoshihara, Koshi, JP;

Tomohiro Iseki, Koshi, JP;

Koji Takayanagi, Koshi, JP;

Assignee:

Tokyo Electron Limited, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05B 13/04 (2006.01); B05C 5/00 (2006.01); B05C 11/10 (2006.01); B05D 1/00 (2006.01); H01L 21/67 (2006.01); G03F 7/16 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02104 (2013.01); B05D 1/005 (2013.01); H01L 21/6715 (2013.01); G03F 7/162 (2013.01); H01L 21/02282 (2013.01);
Abstract

In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.


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