The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
May. 14, 2013
Tokyo Electron Limited, Tokyo, JP;
Masatoshi Deguchi, Kumamoto, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
Disclosed is a bonding system which efficiently performs a bonding of a substrate to a support substrate, thereby improving the throughput in a bonding processing. The disclosed bonding system includes a loading/unloading station and a processing station. The processing station includes: an adhesive applying device configured to apply an adhesive to the wafer; a protective agent applying device configured to apply a protective agent to the wafer, a remover applying device configured to apply a remover to the support wafer, a heat processing device configured to heat the wafer or the support wafer which is applied with at least the adhesive, the protective agent or the remover, at a predetermined temperature, a bonding device configured to bond the wafer to the support wafer through the adhesive, the protective agent and the remover, and a wafer transfer area configured to transfer the wafer, the support wafer or the bonded wafer.