The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Nov. 30, 2012
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Balasubramanian S. Haran, Watervliet, NY (US);

Sanjay Mehta, Niskayuna, NY (US);

Shom Ponoth, Clifton Park, NY (US);

Ravikumar Ramachandran, Pleasantville, NY (US);

Stefan Schmitz, Ballston Spa, NY (US);

Theodorus E. Standaert, Clifton Park, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method including providing a plurality of fins etched from a semiconductor substrate and covered by an oxide layer and a nitride layer, the oxide layer being located between the plurality of fins and the nitride layer, removing a portion of the plurality of fins to form an opening, and forming a dielectric spacer on a sidewall of the opening. The method may also include filling the opening with a fill material, wherein a top surface of the fill material is substantially flush with a top surface of the nitride layer, removing the nitride layer to form a gap between the plurality of fins and the fill material, wherein the fill material has re-entrant geometry extending over the gap, and removing the re-entrant geometry and causing the gap between the plurality of fins and the fill material to widen.


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