The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Mar. 15, 2012
Applicants:
Matthias Lehr, Dresden, DE;
Joerg Hohage, Dresden, DE;
Andreas Ott, Dresden, DE;
Inventors:
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/05647 (2013.01); H01L 24/85 (2013.01); H01L 2224/45147 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01082 (2013.01); H01L 24/03 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/45124 (2013.01); H01L 24/45 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01072 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48747 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01014 (2013.01); H01L 2224/48847 (2013.01); H01L 2924/01074 (2013.01); H01L 2224/85375 (2013.01); H01L 2224/48647 (2013.01); H01L 23/3107 (2013.01); H01L 23/3171 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01015 (2013.01);
Abstract
When forming complex metallization systems on the basis of copper, the very last metallization layer may receive contact regions on the basis of copper, the surface of which may be passivated on the basis of a dedicated protection layer, which may thus allow the patterning of the passivation layer stack prior to shipping the device to a remote manufacturing site. Hence, the protected contact surface may be efficiently re-exposed in the remote manufacturing site on the basis of an efficient non-masked wet chemical etch process.