The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Feb. 13, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jong-yeon Kim, Suwon-si, KR;
Tae-hong Min, Yongin-si, KR;
Yeong-kwon Ko, Seoul, KR;
Tae-je Cho, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Semiconductor packages are disclosed. A semiconductor package includes: a first chip that includes a chip region and scribe regions at edges of the chip region, wherein the chip region comprises integrated circuit units and main through substrate vias electrically connected to the integrated circuit units; and a second chip that is bonded onto the first chip. The semiconductor package includes dummy conductive connectors including at least dummy wiring lines, the dummy conductive connectors electrically connected to the main through substrate vias at one end, and not capable of forming an electrical connection at the other end.