The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2014

Filed:

Oct. 07, 2011
Applicants:

Wei Fang, Milpitas, CA (US);

Zhao-li Zhang, San Jose, CA (US);

Jack Jau, Los Altos Hills, CA (US);

Inventors:

Wei Fang, Milpitas, CA (US);

Zhao-Li Zhang, San Jose, CA (US);

Jack Jau, Los Altos Hills, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.


Find Patent Forward Citations

Fang, Wei. (2014). Method and system of classifying defects on a wafer (U.S. Patent No. 8805054). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8805054

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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