The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Apr. 11, 2013
Applicant:
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Inventors:
Naresh Kumar Penta, Newark, DE (US);
Lee Melbourne Cook, Steelville, PA (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09G 1/02 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/30625 (2013.01);
Abstract
A stable, concentratable silicon wafer polishing composition for polishing silicon wafers is provided, containing: water; an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, optionally, a pH adjusting agent; wherein the polishing composition exhibits a silicon removal rate of at least 300 nm/min. Also provided are methods of making and using the stabilized, concentratable chemical mechanical polishing composition.