The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Mar. 16, 2007
Hideki Arai, Numazu, JP;
Satoshi Inada, Fukushima-ken, JP;
Yoshikazu Moriyama, Izu, JP;
Noriki Juumatsu, Mishima, JP;
Hideki Arai, Numazu, JP;
Satoshi Inada, Fukushima-ken, JP;
Yoshikazu Moriyama, Izu, JP;
Noriki Juumatsu, Mishima, JP;
NuFlare Technology, Inc., Shizuoka-ken, JP;
Abstract
A semiconductor manufacturing equipment is provided herein. The semiconductor manufacturing equipment includes a heater element configured to heat a wafer, a first connection part and a second connection part integrated with the heater element, a first electrode electrically contacted with and fixed to the first connection part on a first surface of the first electrode, and a second electrode electrically contacted with and fixed to the second connection part on a second surface of the second electrode. The second surface is perpendicular to the direction of the first surface, and the heater element produces heat by applying a voltage between the first electrode and the second electrode.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile