The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
May. 11, 2012
Scott E. Thompson, Gainesville, FL (US);
Pushkar Ranade, Los Gatos, CA (US);
Lance Scudder, Sunnyvale, CA (US);
Charles Stager, Austin, TX (US);
Scott E. Thompson, Gainesville, FL (US);
Pushkar Ranade, Los Gatos, CA (US);
Lance Scudder, Sunnyvale, CA (US);
Charles Stager, Austin, TX (US);
Suvolta, Inc., Los Gatos, CA (US);
Abstract
The present disclosure provides methods and structures for measurement, control, and monitoring the thickness of thin film layers formed as part of a semiconductor manufacturing process. The methods and structures presented provide the capability to measure and monitor the thickness of the thin film using trench line structures. In certain embodiments, the thin film thickness measurement system can be integrated with thin film growth and control software, providing automated process control (APC) or statistical process control (SPC) capability by measuring and monitoring the thin film thickness during manufacturing. Methods for measuring the thickness of thin films can be important to the fabrication of integrated circuits because the thickness and uniformity of the thin film can determine electrical characteristics of the transistors being fabricated.