The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Feb. 02, 2012
Xin-hua Huang, Xihu Township, TW;
Ping-yin Liu, Yonghe, TW;
Li-cheng Chu, Taipei, TW;
Yuan-chih Hsieh, Hsin-Chu, TW;
Lan-lin Chao, Sindian, TW;
Chun-wen Cheng, Zhubei, TW;
Chia-shiung Tsai, Hsin-Chu, TW;
Xin-Hua Huang, Xihu Township, TW;
Ping-Yin Liu, Yonghe, TW;
Li-Cheng Chu, Taipei, TW;
Yuan-Chih Hsieh, Hsin-Chu, TW;
Lan-Lin Chao, Sindian, TW;
Chun-Wen Cheng, Zhubei, TW;
Chia-Shiung Tsai, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.