The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Jun. 07, 2011
Applicants:

Shigeki Aoki, Koshi, JP;

Yuichi Sakai, Koshi, JP;

Mitsuo Yamashita, Koshi, JP;

Hiroshi Shinya, Koshi, JP;

Inventors:

Shigeki Aoki, Koshi, JP;

Yuichi Sakai, Koshi, JP;

Mitsuo Yamashita, Koshi, JP;

Hiroshi Shinya, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F26B 3/20 (2006.01); H01L 21/677 (2006.01); F26B 21/00 (2006.01); F26B 9/10 (2006.01);
U.S. Cl.
CPC ...
F26B 3/20 (2013.01); H01L 21/677 (2013.01); F26B 21/001 (2013.01); F26B 9/103 (2013.01);
Abstract

A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.


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