The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Dec. 20, 2010
Harsono S. Simka, Saratoga, CA (US);
Daniel J. Zierath, Portland, OR (US);
Michael G. Haverty, Mountain View, CA (US);
Sadasivan Shankar, Cupertino, CA (US);
Harsono S. Simka, Saratoga, CA (US);
Daniel J. Zierath, Portland, OR (US);
Michael G. Haverty, Mountain View, CA (US);
Sadasivan Shankar, Cupertino, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Electrical interconnects for integrated circuits and methods of fabrication of interconnects are provided. Devices are provided comprising copper interconnects having metallic liner layers comprising silver and a second component, such as, lanthanum, titanium, tungsten, zirconium, antimony, or calcium. Methods include providing a substrate having a trench or via formed therein, forming a silver alloy layer, comprising silver and a second component selected from the group consisting of lanthanum, titanium, tungsten, zirconium, antimony, and calcium, onto surfaces of the feature, depositing a copper seed layer, and depositing copper into the feature.