The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Mar. 14, 2013
Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Mikael Knudsen, Gistrup, DK;

Thorsten Meyer, Regensburg, DE;

Saravana Maruthamuthu, Munich, DE;

Andreas Wolter, Regensburg, DE;

Georg Seidemann, Landshut, DE;

Pablo Herrero, Munich, DE;

Pauli Jaervinen, Wallerfing, DE;

Assignee:

Intel IP Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/06 (2013.01);
Abstract

A semiconductor device may include: a chip; a chip packaging structure at least partially surrounding the chip and having a receiving region configured to receive a first capacitive coupling structure; a first capacitive coupling structure disposed in the receiving region; and a second capacitive coupling structure disposed over the first capacitive coupling structure and capacitively coupled to the first capacitive coupling structure.


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