The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8775995 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 08, 2014

Filed:

Oct. 22, 2012
Applicant:

Lsi Corporation, Milpitas, CA (US);

Inventors:

Ruben Salvador Molina, San Ramon, CA (US);

Alexander Tetelbaum, Hayward, CA (US);

Assignee:

LSI Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5031 (2013.01);
Abstract

A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.


Find Patent Forward Citations

Molina, Ruben. (2014). Method and apparatus of core timing prediction of core logic in the chip-level implementation process through an over-core window on a chip-level routing layer (U.S. Patent No. 8775995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8775995

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