The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
May. 30, 2012
Chine-li Wang, Miaoli County, TW;
Chun-yen Chen, Keelung, TW;
Wei-hua Fang, Kaohsiung, TW;
Hung-hsien Chang, Changhua County, TW;
Yung-chin Yen, Hsinchu County, TW;
Chine-Li Wang, Miaoli County, TW;
Chun-Yen Chen, Keelung, TW;
Wei-Hua Fang, Kaohsiung, TW;
Hung-Hsien Chang, Changhua County, TW;
Yung-Chin Yen, Hsinchu County, TW;
United Microelectronics Corporation, Hsinchu, TW;
Abstract
A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.