The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2014

Filed:

Feb. 12, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Tien-Kan Chung, Pingzhen, TW;

Chung-Hsien Lin, Hsinchu, TW;

Yao-Te Huang, Hsinchu, TW;

Chia-Hua Chu, Zhubei, TW;

Chia-Ming Hung, Taipei, TW;

Wen-Chuan Tai, Dayuan Township, Taoyuan County, TW;

Chang-Yi Yang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 41/311 (2013.01); H01L 41/113 (2006.01); H01L 41/312 (2013.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/311 (2013.01); H01L 41/113 (2013.01); H01L 41/1138 (2013.01); H01L 41/312 (2013.01); B81C 1/00 (2013.01);
Abstract

Provided is a manufacturing method for a micro device. The manufacturing method includes forming a micro-electronic-mechanical system (MEMS) movable structure, forming a plurality of metal loops over the MEMS movable structure, forming a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The method also includes encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element.


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