The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Jan. 05, 2011
Richard S. Graf, Gray, ME (US);
Keishi Okamoto, Kawasaki, JP;
Faraydon Pakbaz, Milton, VT (US);
Jack R. Smith, South Burlington, VT (US);
Sebastian T. Ventrone, South Burlington, VT (US);
Richard S. Graf, Gray, ME (US);
Keishi Okamoto, Kawasaki, JP;
Faraydon Pakbaz, Milton, VT (US);
Jack R. Smith, South Burlington, VT (US);
Sebastian T. Ventrone, South Burlington, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed are embodiments of an integrated circuit chip designed for reliability at low ambient temperatures. The chip substrate can be divided into zones, including at least one temperature-sensitive zone (TSZ) that contains one or more temperature-sensitive circuits. Temperature sensor(s) can be positioned in the semiconductor substrate adjacent to the TSZ. Thermal radiator(s) can be embedded in a metal wiring layer and aligned above the TSZ. The temperature sensor(s) can be operatively connected to the thermal radiator(s) and can trigger operation of the thermal radiator(s) when the temperature in the TSZ is below a predetermined threshold temperature. Additionally, an on-chip power control system can be operatively connected to the thermal radiator(s) so that operation of the thermal radiator(s) is only triggered when a circuit within the TSZ is about to be powered up. Also disclosed are associated embodiments of a system and method for designing such an integrated circuit chip.