The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Jun. 01, 2012
Jengyi Yu, San Ramon, CA (US);
Gengwei Jiang, Lake Oswego, OR (US);
Pramod Subramonium, Beaverton, OR (US);
Roey Shaviv, Palo Alto, CA (US);
Hui-jung Wu, Fremont, CA (US);
Nagraj Shankar, Tualatin, OR (US);
Jengyi Yu, San Ramon, CA (US);
Gengwei Jiang, Lake Oswego, OR (US);
Pramod Subramonium, Beaverton, OR (US);
Roey Shaviv, Palo Alto, CA (US);
Hui-Jung Wu, Fremont, CA (US);
Nagraj Shankar, Tualatin, OR (US);
Novellus Systems, Inc., Fremont, CA (US);
Abstract
Disclosed methods cap exposed surfaces of copper lines with a layer of metal or metal-containing compound combined with silicon. In some cases, the metal or metal-containing compound forms an atomic layer. In certain embodiments, the methods involve exposing the copper surface first to a metal containing precursor to form an atomic layer of adsorbed precursor or metal atoms, which may optionally be converted to an oxide, nitride, carbide, or the like by, e.g., a pinning treatment. Subsequent exposure to a silicon-containing precursor may proceed with or without metallic atoms being converted.