The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2014

Filed:

May. 29, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mahendra Chhabra, Stanford, CA (US);

Scott A. Hendrickson, Brentwood, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Tsutomu Kiyohara, Santa Clara, CA (US);

Juan Carlos Rocha-Alvarez, San Carlos, CA (US);

Alexandros T. Demos, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25C 1/00 (2006.01); C23C 16/44 (2006.01); C23C 14/00 (2006.01); B05D 3/06 (2006.01); H01L 21/67 (2006.01); G02B 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4405 (2013.01); C23C 14/00 (2013.01); B05D 3/066 (2013.01); H01L 21/6719 (2013.01); G02B 1/00 (2013.01);
Abstract

Embodiments of the invention provide methods for curing an ultra low-k dielectric film within a UV processing chamber. In one embodiment, the method includes depositing an ultra low-k dielectric layer on a substrate in a deposition chamber, and subjecting the deposited ultra low-k dielectric layer to a UV curing processes in a UV processing chamber. The method includes stabilizing the UV processing chamber by flowing an oxygen gas and a purge gas into the UV processing chamber at a flow ratio of about 1:50000 to about 1:100. While flowing the oxygen-doped purge gas, the substrate is exposed to UV radiation to cure the deposited ultra low-k dielectric layer. The inventive oxygen-doped purge curing process provides an alternate pathway to build silicon-oxygen network of the ultra low-k dielectric material, thereby accelerating cross-linking efficiency without significantly affecting the film properties of the deposited ultra low-k dielectric material.


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