The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2014

Filed:

Dec. 17, 2009
Applicants:

Ken Nakata, Kanagawa, JP;

Seiji Yaegashi, Kanagawa, JP;

Inventors:

Ken Nakata, Kanagawa, JP;

Seiji Yaegashi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/778 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7789 (2013.01); H01L 29/7787 (2013.01); H01L 29/7788 (2013.01); H01L 29/4236 (2013.01); H01L 29/517 (2013.01); H01L 29/2003 (2013.01); H01L 29/513 (2013.01);
Abstract

A method for fabricating a semiconductor device includes: forming a GaN-based semiconductor layer on a substrate; forming a gate insulating film of aluminum oxide on the GaN-based semiconductor layer at a temperature equal to or lower than 450° C.; forming a protection film on an upper surface of the gate insulating film; performing a process with an alkaline solution in a state in which the upper surface of the gate insulating film is covered with the protection film; and forming a gate electrode on the gate insulating film.


Find Patent Forward Citations

Nakata, Ken. (2014). Method for fabricating semiconductor device (U.S. Patent No. 8748274). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8748274

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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