The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Apr. 19, 2010
Vijay Immanuel Raman, Mannheim, DE;
Ilshat Gubaydullin, Ludwigshafen, DE;
Yuzhuo LI, Heidelberg, DE;
Mario Brands, Ludwigshafen, DE;
Yongqing Lan, Potsdam, NY (US);
Vijay Immanuel Raman, Mannheim, DE;
Ilshat Gubaydullin, Ludwigshafen, DE;
Yuzhuo Li, Heidelberg, DE;
Mario Brands, Ludwigshafen, DE;
Yongqing Lan, Potsdam, NY (US);
BASF SE, Ludwigshafen, DE;
Abstract
An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B) a dissolved organic non-polymeric compound interacting and forming strong, water-soluble complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs.