The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2014

Filed:

May. 25, 2011
Applicants:

Yi-yun Tsai, Penghu County, TW;

Yuan-shun Chang, Taipei, TW;

Kao-way Tu, New Taipei, TW;

Inventors:

Yi-Yun Tsai, Penghu County, TW;

Yuan-Shun Chang, Taipei, TW;

Kao-Way Tu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/326 (2006.01);
U.S. Cl.
CPC ...
Abstract

A trenched power semiconductor device on a lightly doped substrate is provided. Firstly, a plurality of trenches including at least a gate trench and a contact window are formed on the lightly doped substrate. Then, at least two trench-bottom heavily doped regions are formed at the bottoms of the trenches. These trench-bottom heavily doped regions are then expanded to connect with each other by using thermal diffusion process so as to form a conductive path. Afterward, the gate structure and the well are formed above the trench-bottom heavily doped regions, and then a conductive structure is formed in the contact window to electrically connect the trench-bottom heavily doped regions to an electrode.


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