The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Aug. 13, 2012
Chung-lin Wu, San Jose, CA (US);
Steven Sapp, Santa Cruz, CA (US);
Bigildis Dosdos, San Jose, CA (US);
Suresh Belani, Los Altos, CA (US);
Sunggeun Yoon, Cupertino, CA (US);
Chung-Lin Wu, San Jose, CA (US);
Steven Sapp, Santa Cruz, CA (US);
Bigildis Dosdos, San Jose, CA (US);
Suresh Belani, Los Altos, CA (US);
Sunggeun Yoon, Cupertino, CA (US);
Fairchild Semiconductor Corporation, San Jose, CA (US);
Abstract
The multi-chip leadless modulehas integrated circuit (IC), dual n-channel mosfet, IC leads, gate leads, and source leads-encapsulated in resin. The ICand the dual n-channel mosfetare mounted face down on the leads. IC leadsare made of planar metal and connect, respectively, to the electrodes TEST, VDD and VM on the ICusing a flip chip technique to assemble the leads on copper pillars or copper studs.