The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Nov. 29, 2005
Applicants:
Masayuki Ishikawa, Sanda, JP;
Masayoshi Kohinata, Sanda, JP;
Akifumi Mishima, Saitama, JP;
Inventors:
Assignee:
Mitsubishi Materials Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.
Ishikawa, Masayuki. (2014). Au—sn alloy bump including no large void and method of producing same (U.S. Patent No. 8721961). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8721961
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile