The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

Apr. 20, 2011
Applicants:

Saikumar Jayaraman, Chandler, AZ (US);

Paul A. Koning, Chandler, AZ (US);

Ashay Dani, Chandler, AZ (US);

Inventors:

Saikumar Jayaraman, Chandler, AZ (US);

Paul A. Koning, Chandler, AZ (US);

Ashay Dani, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 27/04 (2006.01); B32B 5/00 (2006.01); B32B 15/02 (2006.01); C09K 5/00 (2006.01); C09K 5/02 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.


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