The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Oct. 02, 2008
Russell A. Budd, North Salem, NY (US);
Bing Dang, Ossining, NY (US);
William S. Graham, Irvington, NY (US);
Peter Alfred Gruber, Mohegan Lake, NY (US);
Richard Levine, Poughkeepsie, NY (US);
Da-yuan Shih, Poughkeepsie, NY (US);
Russell A. Budd, North Salem, NY (US);
Bing Dang, Ossining, NY (US);
William S. Graham, Irvington, NY (US);
Peter Alfred Gruber, Mohegan Lake, NY (US);
Richard Levine, Poughkeepsie, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile