The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Jan. 15, 2010
Jin-ho Park, Yongin-si, KR;
Gil-heyun Choi, Seoul, KR;
Byung-lyul Park, Seoul, KR;
Jong-myeong Lee, Seongnam-si, KR;
Zung-sun Choi, Seoul, KR;
Hye-kyung Jung, Seoul, KR;
Jin-Ho Park, Yongin-si, KR;
Gil-Heyun Choi, Seoul, KR;
Byung-Lyul Park, Seoul, KR;
Jong-Myeong Lee, Seongnam-si, KR;
Zung-Sun Choi, Seoul, KR;
Hye-Kyung Jung, Seoul, KR;
Abstract
In a method of manufacturing a semiconductor device, a substrate is loaded to a process chamber having, unit process sections in which unit processes are performed, respectively. The unit processes are performed on the substrate independently from one another at the unit process sections under a respective process pressure. The substrate sequentially undergoes the unit processes at the respective unit process section of the process chamber. Cleaning processes are individually performed to the unit process sections, respectively, when the substrate is transferred from each of the unit process sections and no substrate is positioned at the unit process sections. Accordingly, the process defects of the process units may be sufficiently prevented and the operation period of the manufacturing apparatus is sufficiently elongated.