The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Apr. 19, 2010
Vijay Immanuel Raman, Mannheim, DE;
Ilshat Gubaydullin, Ludwigshafen, DE;
Yuzhuo LI, Heidelberg, DE;
Mario Brands, Ludwigshafen, DE;
Yongqing Lan, Potsdam, DE;
Vijay Immanuel Raman, Mannheim, DE;
Ilshat Gubaydullin, Ludwigshafen, DE;
Yuzhuo Li, Heidelberg, DE;
Mario Brands, Ludwigshafen, DE;
Yongqing Lan, Potsdam, DE;
BASF SE, Ludwigshafen, DE;
Abstract
(A) solid polymer particles being finely dispersed in the aqueous phase and containing pendant functional groups (a1) capable of strongly interacting and forming strong complexes with the metal of the surfaces to be polished, and pendant functional groups (a2) capable of interacting less strongly with the metal of the surfaces to be polished than the functional groups (a1); and (B) an organic non-polymeric compound dissolved in the aqueous phase and capable of interacting and forming strong, water-soluble complexes with the metal of the surfaces to be polished and causing an increase of the material removal rate MRR and the static etch rate SER of the metal surfaces to be polished with increasing concentration of the compound (B); a CMP process comprising selecting (A) and (B) and the use of the CMP agent and process for polishing wafers with ICs.