The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Jul. 24, 2012
Mukta G. Farooq, Hopewell Junction, NY (US);
Emily Kinser, Poughkeepsie, NY (US);
Richard S. Wise, Newburgh, NY (US);
Hakeem B. S. Akinmade-yusuff, Beacon, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Emily Kinser, Poughkeepsie, NY (US);
Richard S. Wise, Newburgh, NY (US);
Hakeem B. S. Akinmade-Yusuff, Beacon, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.