The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
May. 03, 2010
Chenglin Liu, San Jose, CA (US);
Shiann-ming Liou, Campbell, CA (US);
Chenglin Liu, San Jose, CA (US);
Shiann-Ming Liou, Campbell, CA (US);
Marvell International Ltd., , BM;
Abstract
An embodiment includes a method that includes encapsulating a die and at least a portion of a lead-frame in a mold to form a package body. At least one primary lead attached to the lead-frame extends from the package body. The method includes etching a feature to within a threshold in an exposed die pad. The exposed die pad comprises a first surface that is prepared for etching and a second surface opposite to the first surface and attached to the die. The method includes positioning the die within a footprint of the exposed die pad, connecting the die to at least one primary lead, and connecting the feature to the die.