The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2014

Filed:

Sep. 22, 2011
Applicants:

Ming-hsi Yeh, Hsinchun, TW;

Kuo-sheng Chuang, Hsinchu, TW;

Ying-hsueh Chang Chien, New Taipei, TW;

Chi-ming Yang, Hsian-San District, TW;

Chin-hsiang Lin, Hsin-chu, TW;

Inventors:

Ming-Hsi Yeh, Hsinchun, TW;

Kuo-Sheng Chuang, Hsinchu, TW;

Ying-Hsueh Chang Chien, New Taipei, TW;

Chi-Ming Yang, Hsian-San District, TW;

Chin-Hsiang Lin, Hsin-chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure provides a method and apparatus for cleaning a semiconductor wafer. In an embodiment of the method, a single wafer cleaning apparatus is provided and a wafer is positioned in the apparatus. A first chemical spray is dispensed onto a front surface of the wafer. A back surface of the wafer is cleaned while dispensing the first chemical spray. The cleaning of the back surface may include a brush and spray of cleaning fluids. An apparatus operable to clean the front surface and the back surface of a single semiconductor wafer is also described.


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