The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2014

Filed:

May. 02, 2012
Applicants:

Shunan Qiu, Tianjin, CN;

Zhigang Bai, Tianjin, CN;

Xuesong Xu, Tianjin, CN;

Beiyue Yan, Tianjin, CN;

You GE, Tianjin, CN;

Inventors:

Shunan Qiu, Tianjin, CN;

Zhigang Bai, Tianjin, CN;

Xuesong Xu, Tianjin, CN;

Beiyue Yan, Tianjin, CN;

You Ge, Tianjin, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch.


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