The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2014

Filed:

Feb. 28, 2011
Applicants:

Masayuki Nakanishi, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Kenya Ito, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Kenji Iwade, Hiratsuka, JP;

Takeo Kubota, Kuwana, JP;

Takeshi Nishioka, Yokohama, JP;

Inventors:

Masayuki Nakanishi, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Kenya Ito, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Kenji Iwade, Hiratsuka, JP;

Takeo Kubota, Kuwana, JP;

Takeshi Nishioka, Yokohama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.


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