The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Sep. 14, 2012
Chen-fa LU, Gangshan Township, TW;
Chiang-hao Lee, Changhua, TW;
Wei-yu Chen, Taipei, TW;
Chung-shi Liu, Shin-Chu, TW;
Chen-Fa Lu, Gangshan Township, TW;
Chiang-Hao Lee, Changhua, TW;
Wei-Yu Chen, Taipei, TW;
Chung-Shi Liu, Shin-Chu, TW;
Abstract
A method of reducing manufacturing defects of semiconductor wafers during a back-grinding process. The method includes receiving a semiconductor wafer on a chuck table, wherein said chuck table has a surface upon which a front side of the wafer is placed, and wherein said chuck table has one or more holes in surface and one or more sensors placed in said one or more holes. The method further includes grinding at least a portion of a back side of the semiconductor wafer. The method further includes monitoring a parameter, while grinding, measured by the one or more sensors and adjusting the grinding based at least on the monitored parameter.