The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

May. 22, 2012
Applicants:

Yu-ting Lin, Tainan, TW;

Cheng-jung Sung, Tainan, TW;

Yu-sheng Wang, Tainan, TW;

Shiu-ko Jangjian, Tainan, TW;

Wei-ming You, Taipei, TW;

Chih-cherng Jeng, Madou Township, TW;

Ching-hwanq Su, Tainan, TW;

Inventors:

Yu-Ting Lin, Tainan, TW;

Cheng-Jung Sung, Tainan, TW;

Yu-Sheng Wang, Tainan, TW;

Shiu-Ko JangJian, Tainan, TW;

Wei-Ming You, Taipei, TW;

Chih-Cherng Jeng, Madou Township, TW;

Ching-Hwanq Su, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method includes performing a grinding on a backside of a semiconductor substrate. An image sensor is disposed on a front side of the semiconductor substrate. An impurity is doped into a surface layer of the backside of the semiconductor substrate to form a doped layer. A multi-cycle laser anneal is performed on the doped layer.


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