The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
May. 11, 2010
Applicants:
Seng Guan Chow, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Youngcheol Kim, Youngin-si, KR;
Inventors:
Seng Guan Chow, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Youngcheol Kim, Youngin-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling stacking interconnects on the component side; and forming an integrated circuit receptacle, for receiving an integrated circuit device, by molding a reinforced encapsulant on the component side and exposing a portion of the stacking interconnects.