The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2013

Filed:

May. 01, 2012
Applicants:

Noel Rocklein, Boise, ID (US);

Chris Carlson, Nampa, ID (US);

Dave Peterson, Meridian, ID (US);

Cunyu Yang, Huainan, CN;

Praveen Vaidyanathan, Bangalore, IN;

Vishwanath Bhat, Boise, ID (US);

Inventors:

Noel Rocklein, Boise, ID (US);

Chris Carlson, Nampa, ID (US);

Dave Peterson, Meridian, ID (US);

Cunyu Yang, Huainan, CN;

Praveen Vaidyanathan, Bangalore, IN;

Vishwanath Bhat, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/316 (2006.01);
U.S. Cl.
CPC ...
Abstract

Some embodiments include dielectric structures. The structures include first and second portions that are directly against one another. The first portion may contain a homogeneous mixture of a first phase and a second phase. The first phase may have a dielectric constant of greater than or equal to 25, and the second phase may have a dielectric constant of less than or equal to 20. The second portion may be entirely a single composition having a dielectric constant of greater than or equal to 25. Some embodiments include electrical components, such as capacitors and transistors, containing dielectric structures of the type described above. Some embodiments include methods of forming dielectric structures, and some embodiments include methods of forming electrical components.


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