The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Mar. 17, 2011
Applicants:

Tzyy-jang Tseng, Hsinchu, TW;

Chang-ming Lee, Taoyuan County, TW;

Wen-fang Liu, Taoyuan County, TW;

Cheng-po Yu, Taoyuan County, TW;

Inventors:

Tzyy-Jang Tseng, Hsinchu, TW;

Chang-Ming Lee, Taoyuan County, TW;

Wen-Fang Liu, Taoyuan County, TW;

Cheng-Po Yu, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C23C 18/165 (2013.01);
Abstract

A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal pattern layer and the plane and partially covers the plane. The electrically insulating material covers the plane where is not covered by the electrically insulating layer and touches the thermally conductive plate. The electrically insulating layer exposes the electrically insulating material, and a thermal conductivity of the electrically insulating material is larger than a thermal conductivity of the electrically insulating layer.


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