The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Jun. 06, 2011
Applicants:
Seng Guan Chow, Singapore, SG;
Ming Ying, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Roger Emigh, Mesa, AZ (US);
Inventors:
Seng Guan Chow, Singapore, SG;
Ming Ying, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Roger Emigh, Mesa, AZ (US);
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.