The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Aug. 24, 2005
Applicants:

Takeshi Nogami, Hopewell Junction, NY (US);

Masanaga Fukasawa, Fishkill, NY (US);

Inventors:

Takeshi Nogami, Hopewell Junction, NY (US);

Masanaga Fukasawa, Fishkill, NY (US);

Assignees:

Sony Corporation, Tokyo, JP;

Sony Electronics Inc., Park Ridge, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

An arrangement of semiconductor chips is provided. The arrangement includes a plurality of stacked semiconductor chips each including an integrated circuit. At least one via is formed through the thickness of at least one of the semiconductor chips. A carbon nanotube conductor is formed in the via. The conductor has first and second opposite ends. The first end of the conductor is selectively interconnected with the integrated circuit of its semiconductor chip and the second end of the conductor is selectively interconnected with the integrated circuit of another of the semiconductor chips.


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