The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8585872 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 19, 2013

Filed:

Jan. 28, 2008
Applicants:

Satoru Takasawa, Sammu, JP;

Sadayuki Ukishima, Sammu, JP;

Noriaki Tani, Sammu, JP;

Satoru Ishibashi, Sammu, JP;

Inventors:

Satoru Takasawa, Sammu, JP;

Sadayuki Ukishima, Sammu, JP;

Noriaki Tani, Sammu, JP;

Satoru Ishibashi, Sammu, JP;

Assignee:

ULVAC, Inc., Chigasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sputtering apparatus for ensuring high target utilization efficiency is provided. The sputtering apparatusof the present invention comprises a moving meansso that first and second magnet memberscan be moved by the moving meansin planes parallel to the surfaces of first and second targets. When the first and second magnet membersmove, magnetic field lines as well as deeply eroded regions on the surfaces of the first and second targetsalso move, whereby large areas on the surfaces of the first and second targetsare sputtered.


Find Patent Forward Citations

Takasawa, Satoru. (2013). Sputtering apparatus and film-forming processes (U.S. Patent No. 8585872). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8585872

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…