The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Oct. 22, 2010
Dong-chan Lim, Suwon-si, KR;
Gil-heyun Choi, Seoul, KR;
Byung-lyul Park, Seoul, KR;
Sang-hoon Ahn, Hwaseong-si, KR;
Jong-myeong Lee, Seongnam-si, KR;
Dong-Chan Lim, Suwon-si, KR;
Gil-Heyun Choi, Seoul, KR;
Byung-Lyul Park, Seoul, KR;
Sang-Hoon Ahn, Hwaseong-si, KR;
Jong-Myeong Lee, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A via structure may include a first conductive pattern, a buffer pattern, and a second conductive pattern. The first conductive pattern may be on an inner wall of a first substrate and the inner wall may define a via hole passing at least partially through the first substrate. The buffer pattern may be on the first conductive pattern and the buffer pattern may partially fill the via hole. The second conductive pattern may be on a top surface of the buffer pattern in the via hole.