The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8581118 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 12, 2013

Filed:

Aug. 31, 2009
Applicants:

Takashi Kasuga, Osaka, JP;

Hidehiko Mishima, Osaka, JP;

Kazuya Maruyama, Osaka, JP;

Inventors:

Takashi Kasuga, Osaka, JP;

Hidehiko Mishima, Osaka, JP;

Kazuya Maruyama, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 3/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structurefor sealing through holesof housingsin which a wire memberis inserted is configured to include a covering C that includes a spacer memberdisposed on one side of the through hole, secures the spacer member, the wire memberand the housingsto each other and seals them.


Find Patent Forward Citations

Kasuga, Takashi. (2013). Seal structure, method of forming seal structure, wire body, and electronic apparatus (U.S. Patent No. 8581118). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8581118

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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