The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Jul. 13, 2006
Applicants:
Chung-min Fu, Taoyuan County, TW;
Yu-chyi Harn, Hsin-Chu, TW;
Inventors:
Chung-Min Fu, Taoyuan County, TW;
Yu-Chyi Harn, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06Q 99/00 (2006.01); G06Q 30/02 (2012.01); G06Q 10/04 (2012.01);
U.S. Cl.
CPC ...
G06Q 30/0283 (2013.01); G06Q 10/04 (2013.01);
Abstract
A method and a system for predicting shrinkable yield for business assessment of integrated circuit design shrink are provided. An assessment system is provided to determine cost benefits of a design shrink of an integrated circuit chip. A cost benefit analysis across different design shrink technologies is provided early in the process, so that business decisions regarding employment of design shrinks can be made as early as possible.