The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Aug. 20, 2010
Ying-nan Wen, Hsinchu, TW;
Baw-ching Perng, Baoshan Township, Hsinchu County, TW;
Wei-ming Chen, Hsinchu, TW;
Shu-ming Chang, Tucheng, TW;
Ying-Nan Wen, Hsinchu, TW;
Baw-Ching Perng, Baoshan Township, Hsinchu County, TW;
Wei-Ming Chen, Hsinchu, TW;
Shu-Ming Chang, Tucheng, TW;
Other;
Abstract
According to an embodiment of the invention, a chip package is provided. The chip package includes a semiconductor substrate having an upper surface and an opposite lower surface, a through-hole penetrating the upper surface and the lower surface of the semiconductor substrate, a chip disposed overlying the upper surface of the semiconductor substrate, a conducting layer overlying a sidewall of the through-hole and electrically connecting the chip, a first insulating layer overlying the upper surface of the semiconductor substrate, a second insulating layer overlying the lower surface of the semiconductor substrate, and a bonding structure disposed overlying the lower surface of the semiconductor substrate, wherein a material of the second insulating layer is different from that of the first insulating layer.